GB/T 14862-1993 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits

Standard Number: GB/T 14862-1993
Chinese:半导体集成电路封装结到外壳热阻测试方法
English:Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits

Effective Date:1994-10-01
Regulatory Authority:Ministry of Industry and Information Technology（电子）
Issuing Regulatory Authority:State Bureau of Technical Supervision

Adheres to international standards:Y
PDF Downloadable:N

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