GB/T 32280-2022 Test method for warp and bow of silicon wafers-Automated non-contact scanning method

Standard Number: GB/T 32280-2022
Chinese:硅片翘曲度和弯曲度的测试 自动非接触扫描法
English:Test method for warp and bow of silicon wafers-Automated non-contact scanning method

Effective Date:2022-10-01
Regulatory Authority:Standardization Administration of PRC (SAC)
Issuing Regulatory Authority:State Administration for Market Supervision and Administration, China National Standardization Administration

Adheres to international standards:N
PDF Downloadable:Y

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