GB/T 40564-2021 Test method of epoxy molding compound for electronic packaging

Standard Number: GB/T 40564-2021
Chinese:电子封装用环氧塑封料测试方法
English:Test method of epoxy molding compound for electronic packaging

Effective Date:2022-05-01
Regulatory Authority:National Standardization Administration of China
Issuing Regulatory Authority:State Administration for Market Supervision and Administration,National Standardization Administration of China

Adheres to international standards:N
PDF Downloadable:Y

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