GB/T 41852-2022 Semiconductor devices-Micro-electromechanical devices-Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Standard Number: GB/T 41852-2022
Chinese:半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
English:Semiconductor devices-Micro-electromechanical devices-Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Effective Date:2022-10-12
Regulatory Authority:Standardization Administration of PRC (SAC)
Issuing Regulatory Authority:State Administration for Market Supervision and Administration, State Standardization Administration

Adheres to international standards:Y
PDF Downloadable:N

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