GB/T 41853-2022 Semiconductor devices-Micro-electromechanical devices-Wafer to wafer bonding strength measurement

Standard Number: GB/T 41853-2022
Chinese:半导体器件 微机电器件 晶圆间键合强度测量
English:Semiconductor devices-Micro-electromechanical devices-Wafer to wafer bonding strength measurement

Effective Date:2022-10-12
Regulatory Authority:Standardization Administration of PRC (SAC)
Issuing Regulatory Authority:State Administration for Market Supervision and Administration, State Standardization Administration

Adheres to international standards:Y
PDF Downloadable:N

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