GB/T 4937.201-2018 Semiconductor devices-Mechanical and climatic test methods-Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Standard Number: GB/T 4937.201-2018
Chinese:半导体器件 机械和气候试验方法 第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
English:Semiconductor devices-Mechanical and climatic test methods-Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Effective Date:2019-01-01
Regulatory Authority:Ministry of Industry and Information Technology（电子）
Issuing Regulatory Authority:State Administration for Market Supervision and Administration,National Standardization Administration of China

Adheres to international standards:Y
PDF Downloadable:N

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