Standard Number: SJ/T 11186-2019(SJ/T11186-2019)
Chinese:焊锡膏通用规范
English:General Specification for Solder Paste
Effective Date:2020-07-01
Standard Applicability:This standard specifies the solder paste terms and definitions, requirements, test methods, testing rules, signs, packaging, transportation and storage. This standard applies to solder paste for electronic product soldering.
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