Standard Number: SJ/T 11390-2019(SJ/T11390-2019)
Chinese:无铅焊料试验方法
English:Test Methods for Lead Free Solder
Effective Date:2020-07-01
Standard Applicability:This standard specifies the melting temperature of lead-free solder, mechanical stretching, expansion, wetting, solder joints stretching and shear, QFP lead solder joints 45 ° stretch, chip component solder joints shear and cored wire spatter test methods.
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